Automation of Processes and Logistics
UTG(Ultra-Thin Glass) System
Specialized equipment for UTG coating processes, including articulated robot handling, USC cleaning, AP plasma treatment, vision alignment via UVW stage, precision coating, UV curing, defect inspection, and final CST loading/unloading.
Peeler System
This equipment is used in the LCD and OLED manufacturing process to remove dust from the surfaces of CG (Cover Glass) and BA (Board Assembly), peel off protective films, and perform dry surface cleaning.
Slit Coating System
Precision Coating Equipment for Resin or PR on LCD & OLED Glass Surfaces, utilizing a Solution Pump and Slit Nozzle
Gantry Robot Application Roll Packaging System
Heavy Roll Packing Equipment using Gantry Loader and Boxing System
Film Pick & Place System
Equipment that transports the film using a porous vacuum pad and then performs vision alignment on the UVW stage
CMP Pad Buffing system
Buffing process equipment using an articulated robot for full-face polishing in CMP pad production
OCR Laminator
Display manufacturing equipment for mobile devices that precisely applies OCR on the upper surface of the cover glass to attach TSP, LCM, and BLU, and performs vacuum bonding and UV curing between units.
Dispenser MC
High-precision dispensing equipment that supplies additional resin to corner areas during the OCR coating process in Board Assy manufacturing.
Ag-Dotting MC
Equipment that jets high-viscosity AG solution between POL and TFT, and along the side of the TFT, to provide grounding for TSP during the Board Assy manufacturing process.